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		<doi>10.1155/2012/213420</doi>
		<issn>2090-3529</issn>
		<issn>1452-3981</issn>
		<label>lattes: 7595333636841849 6 MatsushimaFeCoBaFeBa:2012:InCuBi</label>
		<citationkey>MatsushimaFerCouBalFer:2012:InCuBi</citationkey>
		<title>Investigation of a Cu/Pd Bimetallic System Electrodeposited on Boron-Doped Diamond Films for Application in Electrocatalytic Reduction of Nitrate</title>
		<project>CAPES (Process no. 02491/09-5), CNPq (processes 471356/2006-and 9305009/2006-0), and FAPESP (Processes nos.05/51387-6, 07/00013-4, and 2009/10661-9).</project>
		<year>2012</year>
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		<author>Matsushima, Jorge T.,</author>
		<author>Fernandes, Valéria C.,</author>
		<author>Couto, Andrea B.,</author>
		<author>Baldan, Maurício Ribeiro,</author>
		<author>Ferreira, Neidenêi Gomes,</author>
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		<group>LAS-CTE-INPE-MCTI-GOV-BR</group>
		<group>LAS-CTE-INPE-MCTI-GOV-BR</group>
		<affiliation></affiliation>
		<affiliation>Instituto de Pesquisa Energéticas e Nucleares—IPEN</affiliation>
		<affiliation></affiliation>
		<affiliation>Instituto Nacional de Pesquisas Espaciais (INPE)</affiliation>
		<affiliation>Instituto Nacional de Pesquisas Espaciais (INPE)</affiliation>
		<electronicmailaddress>jtmatsushima@yahoo.com.br</electronicmailaddress>
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		<electronicmailaddress>baldan@las.inpe.br</electronicmailaddress>
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		<e-mailaddress>baldan@las.inpe.br</e-mailaddress>
		<journal>International Journal of Electrochemistry</journal>
		<volume>2012</volume>
		<pages>1-10</pages>
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		<keywords>Cu/Pd bimetallic system, diamond films, electrocatalytic, morphological analysis.</keywords>
		<abstract>The Cu/Pd bimetallic system electrodeposited on boron-doped diamond (BDD) films for application, as electrode material in the electrochemical reduction of nitrate was studied. The electrochemical behavior of Cu, Pd, and Cu/Pd bimetallic system was evaluated by cyclic voltammetry. From these results, the formation of the Cu/Pd composite was verified. In addition, Cu with different phases and a Cu/Pd phase in the composite were obtained. Morphological analysis by scanning electron microscopy (SEM) revealed a homogeneous distribution of Cu/Pd bimetallic particles with intermediary dimensions compared to those observed in Cu or Pd electrodeposits separately. These composites were tested as electrocatalysts for nitrate reduction in Britton-Robinson buffer solution (pH 9). Electrochemical measurements showed that composites with higher Cu content displayed the best electrocatalytic activity for nitrate reduction, and the Cu/Pd phase in the bimetallic system served to improve the Cu adherence on BDD electrode.</abstract>
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		<language>en</language>
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